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Phoenix Microme|x and Namome|x

The Phoenix Microme|x Neo and Nanome|x Neo provide high-resolution  2D X-ray technology, PlanarCT and 3D computed tomography( CT) scanning in one system, enabling non-destructive testing (NDT) of electronic components - such as semiconductors, PCBs, lithium-ion batteries - in industrial, automotive, aviation and consumer electronics industries. With innovative engineering coupled with ultra-high positioning accuracy, Phoenix Microme|x Neo and Nanome|x Neo are ideally suited for industrial X-ray electronics inspections in process and quality control for greater productivity, failure analysis for the increased safety and quality of your products, and R&D where innovations are born.

BRILLIANT DXR-HD Live Imaging

Waygate Technologies´ exclusive brilliant DXR-HD detector fleet includes:
1) The newest large-size DXR S100 Pro detector - superior pixel resolution defining industry-leading imaging technology:

• Provides superior 100 um pixel resolution and frame rates up to 30 frames per second which combines outstanding detectability with high efficiency
• 300 mm x 250 mm large active area significantly expands the vision and redefines inspection efficiency

​2) Exclusive high dynamic DXR250RT detector - enhanced scintillator technology introduces a new industry standard for efficient live inspection:

• Full frame rate of 30 frames per second at 1000x1000 pixels offers low noise coupled with brilliant image quality ensuring fast and detailed live inspection
• Active temperature stabilization for precise and reliable inspection results
• Extremely fast data acquisition in 3D CT mode
• Detail detectability down to 0.5 μm / 0.2 μm for high-performance failure analysis

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High output with high-resolution: DiamonD|Window

Compared to conventional beryllium targets, the Diamond|window allows higher power at a smaller focal spot. This ensures high-resolution
even at high output.

• Up to 2 times faster CT data acquisition at the same high image quality level
• High output with high-resolution
• Non-toxic target
• Improved focal spot position stability within long term measurements
• Increased target lifetime due to less degradation with higher power density

High-resolution 3D computed Tomography

For advanced inspection and 3D analysis of smaller samples, Phoenix|x-ray’s proprietary 3D CT technology is optionally available.

• 180 kV / 20 W high power X-ray technology, fast image acquisition with DXR detector and diamond|window combined with Phoenix|x-ray’s fast reconstruction software deliver high-quality inspection results
• Maximum voxel resolution down to 2 microns; the nanoCT® capability of the Nanome|x allows higher image sharpness

X|act - CAD based inspection: FLASH!

High-resolution μAXI for extremely high defect coverage

As a solution for μAXI with extremely high defect coverage, phoenix|x-ray provides its high precision systems MicromeIx Neo and NanomeIx Neo including the unique X|act software package for fast and easy offline CAD programming.

Its intuitive new GUI with improved outstanding precision and repeatability, small views with resolutions of only a few micrometers, 360° rotation, and oblique viewing up to 70° ensures meeting the highest quality standards – even for inspection of components with a pitch of just 100 microns.

​Besides automated inspection, X|act ensures an easy pad identification by its live CAD data overlay function even in manual inspection while FLASH!™ image optimization ensures high defect coverage.

Efficient CAD Programming

X|act provides not only a minimal setup time compared to conventional view based AXI – once programmed, the inspection program is portable to all X|act compatible systems. The result is fast and easy programming: just assign the inspection strategies and let X|act generate the automated inspection program

• Easy pad-based offline programming
• Specific inspection strategies for different pad types
• Fully automated inspection program generation
• Extremely high positioning accuracy even at oblique viewing and rotation
• Easy pad identification in manual X-ray inspection
• High reproducibility on large PCBs

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Virtual Board Slicing with Planar|CT

Planar|CT slice or multislice views allow exact inspection results of a single plane or a whole package. 

• Easy 2D slice or 3D volume evaluation of large complex boards
• No board cutting, no overlaying structures as in X-ray images

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Cutting-Edge Detail Detectability, Speed, and Image Quality

• Brilliant live inspection images with high dynamic Waygate Technologies DXR digital detector array
• Large 27” monitor and ultra-high defect coverage and repeatability
• Detail detectability at 0.5 µm or 0.2 µm with nanofocus
• Live overlay of CAD and inspection results even in rotated oblique inspection views
• High power 180 kV / 20 W microfocus or nanofocus tube for high absorbing electronic samples

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Navigation Map Orientation

Clear overview and fast positioning: 
•  Optical camera image or X-ray overview image for whole sample
    as navigation map
•  Fast manipulation by clicking on the map
•  Inspection program can be set based on the optical navigation map
•  Position on the map can be saved into test report generated by X|act

Smart Dose Management

Waygate Technologies´ proprietary Shadow|target inside the X-ray tube enables a reduction of unnecessary radiation dose of up to 60% compared to conventional x-ray tubes during a typical inspection. Combined in a low-dose bundle together with the brand new Dose|manager tool, it enables real-time dose monitoring and controlling

This solution protects radiation sensitive inspected components from aging to worst case damage.

• The Shadow|target is linked with the Dose|manager tool
• Shadow|target prevents frequent generator start & stop to reduce unwanted radiation
• Fast and stable X-ray recovering. No delay of energy running up
• Dose measurement: Realtime visualization of projected dose through “heat map”
• Cumulated dose counting per inspection
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In the Dose|manager tool, rainbow coloring is visualizing the projected X-ray dose in real time:
Left image: Dose Map without Shadow|target.
Right image: Dose Map with Shadow|target.

Efficient and Transportable for In-Field Applications

• Minimized setup time due to highly efficient automated CAD programming
• Designed for portability with compact, state-of-the-art electronics
• Intuitive GUI interface with fully automated inspection program generation

Options for Optimization and 3D Scanning​

• Optional FLASH!™ image optimization technology
• Optional advanced failure analysis with high-resolution 3D micro- or nanoCT® or large board PlanarCT
• Optional 3D CT scans up to 10 seconds